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Highly Thermally Conductive Composite Materials - List of Manufacturers, Suppliers, Companies and Products

Highly Thermally Conductive Composite Materials Product List

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"Courier" (EP) Insulating High Thermal Conductivity Composite Material

"Courier" (EP) Insulating High Thermal Conductivity Composite Material

This is a material developed to address challenges such as "high thermal conductivity, metal adhesion, low-temperature curing, and low-pressure molding." We can provide proposals that include customization.

"Epoclustar Coolie" is a solid sealing material developed for transfer molding based on epoxy resin. It is a custom material unique to our company, designed for semiconductor, motor, and coil sealing applications. 【Achievements】 - High thermal conductivity grades (1–6 W/m·K) - Metal adhesion properties (Ni, Al, Au, Cu, Ag, etc.) - Grades suitable for thin-walled molding *The catalog includes representative grades. We can also propose materials outside of the catalog depending on your application, so please feel free to contact us.

  • Engineering Plastics
  • plastic
  • Composite Materials

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[Examples of Diffusion Bonding Adaptation] Low Thermal Expansion High Thermal Conductivity Materials

[Examples of Diffusion Bonding Adaptation] Low Thermal Expansion High Thermal Conductivity Materials

Constructed with a core and core plate! Introducing a composite material that achieves both thermal conductivity and low thermal expansion rate.

We would like to introduce an example of diffusion bonding application for our "low thermal expansion high thermal conductivity material." It consists of a columnar body that facilitates heat transfer in the direction perpendicular to the surface, and a plate that suppresses the thermal expansion coefficient in the plane. The thermal conductivity is approximately 280 W/mK, and the in-plane thermal expansion coefficient is 5 to 10 ppm/K, making it a composite material that balances thermal conductivity and low thermal expansion. 【Features】 ■ Thermal conductivity: Approximately 280 W/mK ■ In-plane thermal expansion coefficient: 5 to 10 ppm/K ■ A composite material that balances thermal conductivity and low thermal expansion ■ Composed of a core and core plate *For more details, please refer to the PDF document or feel free to contact us.

  • Heat exchanger
  • Other electronic parts
  • air conditioning

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High thermal conductivity product 'TC-1050ALY'

High thermal conductivity product 'TC-1050ALY'

Incredible thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material TPG, manufactured using our CVD technology, with various other materials. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can accommodate various sizes and shapes. It can be used for a variety of applications, including thermal diffusion materials, PCB thermal conduction core materials, and high-performance heat sinks. 【Features】 ■ Thermal conductivity characteristics three times that of copper ■ Lighter than aluminum ■ Adjustment of thermal expansion rate with sealing materials ■ Low thermal resistance ■ Reliability through passive conduction *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics

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【A must-see for those struggling with heat dissipation!】High thermal conductivity product 'TC-1050ALY'

【A must-see for those struggling with heat dissipation!】High thermal conductivity product 'TC-1050ALY'

Incredible thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material TPG with various materials using our CVD technology. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can accommodate various sizes and shapes. It can be used for various applications, including thermal diffusion materials, improving the performance of PCB thermal conductive core materials, and heat sinks. 【Features】 ■ Thermal conductivity characteristics three times that of copper ■ Lighter than aluminum ■ Thermal expansion adjustment with sealing materials ■ Low thermal resistance ■ Reliability through passive conduction *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics
  • Other Auto Parts
  • Ceramics

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[Attention Aerospace Industry Professionals!] High Thermal Conductivity Product 'TC-1050ALY'

[Attention Aerospace Industry Professionals!] High Thermal Conductivity Product 'TC-1050ALY'

Amazing thermal conductivity of 1,000 W/mK! A high thermal conductivity product with three times the thermal conductivity characteristics of copper.

The "TC-1050ALY" is a unique product that combines our excellent high thermal conductivity material, TPG, with various other materials using our CVD technology. It possesses thermal conductivity characteristics three times that of copper and is lighter than aluminum. It can be adapted to various sizes and shapes. It can be used in a variety of applications, including the aerospace industry, display thermal diffusion materials, PCB thermal conductive core materials, and improving the performance of heat sinks. 【Features】 ■ High heat dissipation characteristics with thermal conductivity exceeding 1000W/mK ■ Can be handled like metal with surface treatment, soldering, and brazing ■ Lightweight and compact ■ Thermal conductivity three times that of copper ■ Lighter than aluminum ■ Thermal expansion adjustment with sealing materials ■ Low thermal resistance ■ Reliability through passive thermal control unaffected by gravity *For more details, please refer to the catalog or feel free to contact us.

  • Fine Ceramics
  • Other Auto Parts
  • Ceramics

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